Wire bonding to flexible substrates

Details Wire bonding to flexible substrates Wire bonding to flexible substrates

1995-03-21

1998-02-03

Watson, Robert C.

Work holders

With fluid means

Vacuum-type holding means

269903, B25B 1100

Patent

active

057135630

ABSTRACT:
Apparatus for releasably securing a flexible printed wiring board in preparation for electrically connecting an electronic component thereto may comprise an air permeable platen having a substantially flat front surface and a back surface. Vacuum pump apparatus in fluid communication with the back surface of the air permeable platen produces a pressure differential between the back surface of the air permeable platen and the front surface of the platen. The pressure differential securely holds the flexible printed wiring board flat against the front surface of the air permeable platen.

REFERENCES:
patent: 1062579 (1913-05-01), Aylsworth
patent: 3355078 (1967-11-01), Smith
patent: 4675242 (1987-06-01), Hashimoto et al.
patent: 4790897 (1988-12-01), Long
Hewlett-Packard Journal, Oct. 1984 vol. 35, No. 10.

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