Solder ball arrangement device

Details Solder ball arrangement device Solder ball arrangement device

1998-06-01

2000-08-01

Mills, Gregory

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

22818022, 228246, B23K 100, B23K 3512

Patent

active

060953985

ABSTRACT:
A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.

REFERENCES:
patent: 5425493 (1995-06-01), Interrante et al.
patent: 5601229 (1997-02-01), Nakazato et al.
patent: 5685477 (1997-11-01), Mallik et al.
patent: 5749614 (1998-05-01), Reid et al.
patent: 5762258 (1998-06-01), Le Coz et al.
patent: 5768775 (1998-06-01), Nakazato
patent: 5816482 (1998-10-01), Grabbe
patent: 5839641 (1998-11-01), Teng
patent: 5844316 (1998-12-01), Mallik et al.
patent: 5890283 (1999-04-01), Sakemi et al.

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