Polishing pad, polishing apparatus and polishing method

Abrading – Abrading process – Glass or stone abrading

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451285, 451287, 451288, 451533, 451526, B24B 100

Patent

active

056649894

ABSTRACT:
A polishing pad comprises at least a first layer having a first main surface serving to polish a substrate to be polished and a second main surface, and a second layer positioned to face the second main surface of the first layer and having fine bags arranged therein, fluid being hermetically sealed in the fine bag.

REFERENCES:
patent: 3504457 (1970-04-01), Jacobsen et al.
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5257478 (1993-11-01), Hyde et al.
H. Jeong et al. "New Polishing Techniques for Planarization of VLSI Device Wafers," First International ABTEC Cont. Nov. 1993; pp. 80-85.

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