Resin composition and resin-molded type semiconductor device

Details Resin composition and resin-molded type semiconductor device Resin composition and resin-molded type semiconductor device

1996-05-24

1999-10-12

Yoon, Tae

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524611, 525391, 525534, 525535, 525536, 525537, C08L 6502, C08L 8106, C08G 7500

Patent

active

059656638

ABSTRACT:
A resin composition comprising (a) polyarylene polyether represented by the general formula of Z.sub.1 -(polyarylene polyether) chain-Z.sub.1 ' (wherein Z.sub.1 and Z.sub.1 ' denote individually a monovalent organic group containing a cross-linkable unsaturated carbon-carbon linkage), and (b) an inorganic filler.

REFERENCES:
patent: H521 (1988-09-01), Fan
patent: 3887582 (1975-06-01), Holub et al.
patent: 4093600 (1978-06-01), Fan et al.
patent: 4550140 (1985-10-01), Rimsa et al.
patent: 4772653 (1988-09-01), McKenna
patent: 4871816 (1989-10-01), Percec et al.
patent: 5091480 (1992-02-01), Percec
patent: 5093435 (1992-03-01), Harris et al.

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