Method of and apparatus for control of reactive sputtering depos

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204192R, 204298, C23C 1500

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active

043361196

ABSTRACT:
A method and apparatus for the control of reactive sputtering deposition of oxide-containing films, including the monitoring of and maintaining the constancy of the deposition rate and total pressure of the system by adjustment of the oxygen and argon input flow rates. Deposition rate is monitored by an activated quartz crystal, and behaves as a sensitive function of actual oxygen partial pressure. Stoichiometry, optical and electrical properties of the oxide-containing films are therefore controllable by maintaining constant oxygen partial pressure.

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