Method for fabricating devices including multicomponent metal ha

Details Method for fabricating devices including multicomponent metal ha Method for fabricating devices including multicomponent metal ha

1987-09-30

1990-01-23

Chaudhuri, Olik

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

65 2, 65 311, 65 83, 65 84, 65DIG16, C03C 1304

Patent

active

048958131

ABSTRACT:
A new method for fabricating devices which include multicomponent metal halide glasses, e.g., multicomponent metal halide glass optical fibers, is disclosed. In accordance with the inventive method, a multicomponent metal halide glass body, essentially free of crystallites, is produced by cooling essentially every portion of a melt incorporated into the glass body at a quench rate which is necessarily greater than or equal to about 10 Kelvins per second (K/sec). This necessary quench rate is achieved by successively quenching relatively small portions of the melt, e.g., thin layers or droplets of melt material, having relatively small cross-sectional dimensions.

REFERENCES:
patent: 4308066 (1981-12-01), Mitachi et al.
patent: 4346176 (1982-08-01), Kanamori et al.
patent: 4378987 (1983-04-01), Miller et al.
patent: 4380588 (1983-04-01), Mitachi et al.
patent: 4674835 (1987-06-01), Mimura et al.
patent: 4699464 (1987-10-01), Cohen et al.
patent: 4704371 (1987-11-01), Krolla et al.
patent: 4711652 (1987-12-01), Roba et al.
patent: 4741752 (1988-05-01), France et al.

Affiliated with

Also associated with

Rating

Method for fabricating devices including multicomponent metal ha does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating devices including multicomponent metal ha, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating devices including multicomponent metal ha will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-645207