Printed circuit substrate

Details Printed circuit substrate Printed circuit substrate

1988-09-23

1990-01-23

Robinson, Ellis P.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283191, 428323, 428408, 428422, 428901, 361397, 361398, 174 685, B32B 522

Patent

active

048957569

ABSTRACT:
A printed circuit is provided wherein the electrically conductive material which forms the circuit elements is embedded within a dielectric substrate. The preferred dielectric substrate is porous, expanded polytetrafluoroethylene.

REFERENCES:
patent: 2866764 (1958-12-01), West
patent: 3107197 (1963-10-01), Stein et al.
patent: 4429216 (1984-01-01), Brigham

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