Process for forming a sintered conductor circuit board

Details Process for forming a sintered conductor circuit board Process for forming a sintered conductor circuit board

1994-03-17

1995-04-18

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156235, 156240, 156289, 156902, B44C 1165, B32B 3100

Patent

active

054075114

ABSTRACT:
A circuit board that is made compact or highly dense and can be prepared using no chemical etching is obtained by patternwise printing a sinterable conductor on a releasing substrate, sintering the conductor by heating at a given temperature, and transferring the sintered conductor to a resin support. A plurality of sintered conductors each prepared by the above process may be laminated to give a multi-layered circuit board.

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patent: 5162240 (1992-11-01), Saitou et al.
H. Ohdaira, "Plastic Multilayer Wiring Boards", Toshiba Review, vol. 45, No. 12, 1990, pp. 974-976.
M. Aoki et al., "Copper-Clad Laminates for Printed Wiring Boards", Toshiba Review, vol. 45, No. 12, 1990, pp. 980-982.
Tsukada, SLC (Surface Laminar Circuit), Surface Mounting Technology, 1991, pp. 28-34. Coble et al., "Sintering in Ceramics", Progress in Ceramic Science, vol. 3, 1963, p. 199.

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