Method for producing a semiconductor device having an improved a

Details Method for producing a semiconductor device having an improved a Method for producing a semiconductor device having an improved a

1993-09-16

1995-04-18

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 437209, 437215, 29841, H05K 503, H05K 506, H05K 1304, C03C 1734

Patent

active

054075025

ABSTRACT:
A method is provided wherein semiconductor device includes a package, a semiconductor chip provided on the package, an intermediate layer formed on the package, an adhesive layer formed on the intermediate layer, and a lid formed on the adhesive layer and sealing the semiconductor chip. The intermediate layer contains a major component which is the same as a major component of the package. The method includes screen printing the intermediate layer on a predetermined area of the package and the formation of a roughened surface by sintering the intermediate layer. The major component comprises, among other materials, alumina or alumina and glass.

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