Method and apparatus for in-situ removal of material from openin

Cleaning and liquid contact with solids – Processes – Using solid work treating agents

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134 16, 134 23, 134 32, 134 42, B08B 700

Patent

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054074886

ABSTRACT:
In-situ removal of material, such as solder paste (12), from openings (26--26) in a stencil (22) is accomplished by imparting a vibrational motion to the stencil. In practice, the stencil (22) may be vibrated by one or more DC solenoids (28--28), each having its plunger (28) in contact with the periphery of the stencil and each excited with AC so that the solenoid plunger undergoes a linear oscillation to vibrate the stencil.

REFERENCES:
patent: 3833123 (1974-09-01), Walker
patent: 3902414 (1975-09-01), Zimmer et al.
patent: 4462174 (1984-07-01), Messerschmitt
patent: 4826539 (1989-05-01), Harpold

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