Printed wiring board having an electromagnetic wave shielding la

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174 35R, 174250, 174255, 361748, 29830, H05K 102, H05K 300

Patent

active

054166675

ABSTRACT:
A printed wiring board comprises a substrate, a printed wiring circuit formed on the substrate, and insulating layer formed on the printed wiring circuit, an electromagnetic wave shielding layer provided on the insulating layer, and an overcoat layer provided on the electromagnetic shielding layer. The electromagnetic shielding layer has a first color, and the overcoat layer has a second color different from the first color. The color of the overcoat layer may be any color which is easily visually distinguishable from the color of the electromagnetic wave shielding layer so that visual inspection of the working condition of the overcoat layer is facilitated.

REFERENCES:
patent: 5025116 (1991-06-01), Kawakami et al.
patent: 5112648 (1992-05-01), Okonogi et al.
patent: 5236736 (1993-08-01), Kawakami et al.
patent: 5262596 (1993-11-01), Kawakami et al.
patent: 5270493 (1993-12-01), Inoue et al.

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