Method for applying adhesive to a hologram film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

4272082, 427322, 427327, 427365, 4273831, 4273935, 427409, 4274121, B05D 306

Patent

active

050117076

ABSTRACT:
The method for applying an adhesive to a hologram film includes the steps of: treating one side surface of a hologram film for enhancing the adhesive of an adhesive material thereto; extruding a hot melt of thermoplastic adhesive material onto said one side surface of the hologram film; and, allowing the thermoplastic adhesive material to dry.

REFERENCES:
patent: 4014602 (1977-03-01), Ruell
patent: 4121003 (1978-10-01), Williams
patent: 4171864 (1979-10-01), Jung et al.
patent: 4381329 (1983-04-01), Dallman et al.
patent: 4456667 (1984-06-01), Bochow et al.
patent: 4519155 (1985-05-01), Gallagher et al.
patent: 4592976 (1986-06-01), Whitehead
patent: 4684795 (1987-04-01), Colgate, Jr.
patent: 4754128 (1988-06-01), Takeda et al.
patent: 4789211 (1988-12-01), Wreede
patent: 4838965 (1989-06-01), Bussard

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