Process for producing a rod-form silica

Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing

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423339, 501 4, 501 12, 501133, C01B 33146

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050116690

ABSTRACT:
A process for producing a rod-form silica from a silicic acid ester according to a sol-gel process, which silica has a rod-form having a high aspect ratio and is advantageously used as a filler for resin sealants for semiconductors, is provided, which process comprises adding 35 to 150 parts by weight of a sol of a silicic acid ester to 100 parts by weight of a hydrophobic medium to form an emulsion, subjecting the emulsion to a temperature rise at two stages, the first temperature rise being by 5.degree. to 30.degree. C. at a rate of 10.degree. to 200.degree. C./min. or less and the second temperature rise being by 3.degree. to 20.degree. C. at a rate of 0.5.degree. to 10.degree. C./min., to form a rod-form silica.

REFERENCES:
patent: 4594330 (1986-06-01), Suzuki et al.
patent: 4865829 (1989-09-01), Hattori et al.

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