Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1976-03-22
1978-03-28
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29589, 29591, 204 15, B01J 1700
Patent
active
040807223
ABSTRACT:
A metal film is deposited on both sides of a semiconductor wafer. A conductive support layer, e.g. gold, is deposited on one of the metal film layers. Using standard procedures, the semiconductor material is then etched to form a plurality of semiconductor devices on the support. A photoresist is next applied over the device side of the support. Windows are opened into the photoresist above each of the devices. A gold wire is attached near the edge of each device so that the devices are each electrically connected in parallel to all of said devices and to said support. A copper heat capacitor is now plated on each device. The gold wires and the photoresist are removed, leaving a copper heat capacitor on the semiconductor device. A copper heat can be formed on the device, with or without formation of the copper heat capacitor, but always after formation of the device per se.
REFERENCES:
patent: 3462829 (1969-08-01), Lutz
patent: 3535773 (1970-10-01), Bakker
patent: 3579815 (1971-05-01), Gentry
patent: 3795045 (1974-03-01), Dumas
patent: 3897627 (1975-08-01), Klatskin
patent: 3932226 (1976-01-01), Klatskin
Klatskin Jerome Barnard
Rosen Arye
Christoffersen H.
Morris B. E.
RCA Corporation
Tupman W.
Zavell A. Stephen
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