Maximized substrate design for grid array based assemblies

Details Maximized substrate design for grid array based assemblies Maximized substrate design for grid array based assemblies

1995-04-07

1997-07-29

Picardat, Kevin

Fishing, trapping, and vermin destroying

437209, 437211, 437214, 437217, H01L 2160

Patent

active

056521855

ABSTRACT:
A method of packaging a BGA assembly, with a substrate that has been formed from a substrate strip whose area has been maximized, is disclosed herein. In a first embodiment, the method includes forming individual units by punching stress relief slots around the periphery of the units on the strip. The slots perform a dual function of providing stress relief during manufacturing and serve as boundaries between the individual units to eliminate excess material between units. The units are attached to the substrate by support sites that are subsequently punched to separate the individual units from the strip thereby simplifying the separation operation. Thus a relatively simple operation of punching the support sites instead of punching out around the entire device can be used to singulate the units. This decreases the punching force necessary for separation which reduces likelihood of substrate damage and increases the life of the punching tool. Further, the design results in significant savings by efficient substrate utilization to increase the number of units that will fit on a strip thereby increasing yield.

REFERENCES:
patent: 4331740 (1982-05-01), Burns
patent: 5036380 (1991-07-01), Chase
patent: 5057456 (1991-10-01), Dehaine
patent: 5286680 (1994-02-01), Cain
patent: 5339518 (1994-08-01), Tran et al.
patent: 5382546 (1995-01-01), Yamada et al.

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