Solder marking device and method of marking solder

Details Solder marking device and method of marking solder Solder marking device and method of marking solder

1994-05-03

1995-05-16

Heinrich, Samuel M.

Metal fusion bonding

Process

Feeding unfused filler into fusing contact with work part

228246, 228 13, 228 41, B23K 306

Patent

active

054153387

ABSTRACT:
A device automatically places marks, such as notches, on solder as that solder is being dispensed to a soldering operation. The device is entirely mechanical, and places the proper amount of tension on the solder without stretching it, and guides the solder from a storage reel to a marking system. The solder is marked by elements located on a marking wheel that rotates next to a grooved wheel. The tensioning is effected by a plurality of grooved wheels around which the solder is trained and which can be adjusted to control the amount of tension applied to the solder.

REFERENCES:
patent: 4021876 (1977-05-01), Engelhardt
patent: 4056136 (1977-11-01), Miller
patent: 4212265 (1980-07-01), Buxton
patent: 4750664 (1988-06-01), Furtek
patent: 4932581 (1990-06-01), Ohle et al.
patent: 5036174 (1991-07-01), Iwasaki et al.
patent: 5289767 (1994-03-01), Montalto et al.

Affiliated with

Also associated with

Rating

Solder marking device and method of marking solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder marking device and method of marking solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder marking device and method of marking solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-633250