Semiconductor chip packages

Details Semiconductor chip packages Semiconductor chip packages

1992-10-07

1996-04-30

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257786, 257778, 257783, H01L 2348, H01L 2302

Patent

active

055127835

ABSTRACT:
A semiconductor chip package comprising at least one semiconductor chip disposed in a package and a plurality of first and second pins extending from the package, which first pins are electrically connected to the at least one semiconductor chip and are adapted to conduct signals between the at least one semiconductor chip and external circuitry, the first pins being divided into a plurality of groups, each group representing a respective signal type, and which second pins are not electrically connected to the at least one semiconductor chip, the first pins of at least one group and the second pins being asymmetrically disposed along edges of the package and the remaining groups of first pins being symmetrically disposed along edges of the package. The invention also provides a stacked module of the semiconductor chip packages.

REFERENCES:
patent: 4632293 (1986-12-01), Feinstein
patent: 4868712 (1989-02-01), Woodman
patent: 4907128 (1990-03-01), Soloman et al.
patent: 4953060 (1990-08-01), Lauffer et al.
patent: 4956694 (1990-09-01), Eide
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 4979016 (1990-12-01), Lee
patent: 5016138 (1991-05-01), Woodman

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