Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1996-01-24
1998-04-14
Morgan, Eileen P.
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 41, 451287, 451288, B24B 4916
Patent
active
057385629
ABSTRACT:
A chemical-mechanical polishing apparatus includes a slurry-wetted polishing pad attached to a substantially planar surface of a platen. A wafer carrier is positioned in close proximity to the platen, and it has a substantially planar surface to which one side of a semiconductor wafer is removably attachable so that an opposing side of the semiconductor wafer is disposed against the polishing pad. An actuator imparts a translational motion to the platen so that the polishing pad moves relative to and in polishing contact with the semiconductor wafer. A sensor detects a change in the imparted translational motion corresponding to a change in the coefficient of friction between the polishing pad and the opposing side of the semiconductor wafer indicative of a planar end point on the opposing side of the semiconductor wafer. The sensor preferably includes a laser and a laser detector using a laser reflection or laser interferometric method to detect the change in the imparted translational motion. Also, the apparatus preferably includes a controller coupled to the sensor and the actuator to adjust the actuator in response to the sensor detecting a change in the imparted translational motion.
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Doan Trung Tri
Grief Malcolm K.
Sandhu Gurtej Singh
Micro)n Technology, Inc.
Morgan Eileen P.
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