Plated metallic cathode with porous copper subplating

Details Plated metallic cathode with porous copper subplating Plated metallic cathode with porous copper subplating

1978-05-01

1979-05-01

Edmundson, F. C.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204 40, 204 43T, 204293, 428663, 428674, C25B 1106, C25D 338, B32B 1520, B32B 1500

Patent

active

041522400

ABSTRACT:
A low overvoltage cathode is disclosed which has a metal substrate plated with a porous coating of dendritic copper which is in turn plated with a low overvoltage metal alloy. The substrate is preferably copper and the low overvoltage alloy is preferably a Ni-Mo alloy.

REFERENCES:
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patent: 3943048 (1976-03-01), Fisher et al.
patent: 3947331 (1976-03-01), Kinh et al.
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patent: 3988119 (1976-10-01), Takahashi et al.
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patent: 4080278 (1978-03-01), Ravier et al.
patent: 4088547 (1978-05-01), Albertson
patent: 4105531 (1978-08-01), Kuo et al.
Stasov et al., Soviet Electrochem. 8, 1296-1297 (1972).
Imanage, Koygo Kagaku Zasshi 66 (12) 1792-1795 (1963).
Higashi et al., Kinzoku Hyomengisy Utsu 27 (11) 590-595 (1976).

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