Flip substrate for chip mount

Details Flip substrate for chip mount Flip substrate for chip mount

1988-02-19

1990-05-15

James, Andrew J.

357 71, 357 74, 357 80, H01L 2316

Patent

active

049262416

ABSTRACT:
A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical devices on the side of the support opposite the interconnect at the vias, rather than on the interconnect itself. By so doing, the chips can be packed more densely since the area between the chips normally reserved for engineering change pads, test pads and the like is not required, these functions being performed on the interconnect on the opposite side of the substrate.

REFERENCES:
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4322778 (1982-03-01), Barbour et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4665468 (1987-05-01), Dohya
patent: 4667219 (1987-05-01), Lee et al.
patent: 4667220 (1987-05-01), Lee et al.
patent: 4682207 (1987-07-01), Akasaki et al.
patent: 4685033 (1987-08-01), Inoue
patent: 4811082 (1989-03-01), Jacobs et al.
Blodgett, "Microelectronic Packaging", Scientific American, Jul. 1983, pp. 86-96.

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