Method of mounting a compact circuit package to a heat sink or t

Metal working – Method of mechanical manufacture – Assembling or joining

Patent

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Details

29526R, 29842, 174 16HS, B23P 2500

Patent

active

045773874

ABSTRACT:
A compact circuit package includes a housing providing a cavity for containing heat generating electrical components. A ceramic substrate is mounted to close the cavity. The package is adapted to be mounted in heat transferring relationship with a heat sink. The bottom surface of the compact circuit package is provided with a self-contained chamber containing a supply of grease. The chamber is defined by the package bottom surface and a bubble of plastic film which overlies the substrate and which is removable sealed to the package around the periphery of the substrate. In this form, the compact circuit package can be transported and stored until ready for use. When the package is ready to be mounted to a heat sink, pressure such as by a finger is applied to the top surface of the bubble film to thereby spreadingly apply the grease to the surface of the substrate. The film is then removed from the bottom of the compact circuit package and the greasy underside of the film placed into engagement with the heat sink surface and rubbed, as by a finger, to thereby spread the remaining residue grease onto the heat sink. The film is then removed and discarded and the compact circuit package mounted to the heat sink.

REFERENCES:
patent: 3764856 (1973-10-01), Martin
patent: 3958075 (1976-05-01), Kaufman
patent: 3996447 (1976-12-01), Bouffard et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4155402 (1979-05-01), Just
patent: 4155547 (1979-05-01), Rhoades et al.
patent: 4196411 (1980-04-01), Kaufman
patent: 4203186 (1980-05-01), Horner
patent: 4218724 (1980-08-01), Kaufman
patent: 4237086 (1980-12-01), Gehle
patent: 4266267 (1981-05-01), Ruegg
patent: 4394530 (1983-07-01), Kaufman

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