Heat-stable copolycondensate molding materials

Details Heat-stable copolycondensate molding materials Heat-stable copolycondensate molding materials

1987-04-09

1990-05-15

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528173, 528174, C08K 334

Patent

active

049259105

ABSTRACT:
Copolycondensate molding materials are obtainable by polycondensation of
from 2 to 98 mol % of 2,2-di-(4'-hydroxyphenyl)-propane (A),
from 2 to 98 mol % of 4,4'-dihydroxydiphenyl sulfone (B) and
from 0 to 96 mol % of (C) ##STR1## where R.sup.1 and R.sup.2 are each H, C.sub.1 -C.sub.6 -alkyl or C.sub.1 -C.sub.6 -alkoxy, X is a chemical bond, --S--, --O--, --CO--, CR.sup.3 R.sup.4 (where R.sup.3 and R.sup.4 are different when n and p are each 0), or SO.sub.2 -- only when n or p is 0), R.sup.3 and R.sup.4 are each H, C.sub.1 -C.sub.6 -alkyl, C.sub.1 -C.sub.6 -alkoxy, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1, and n and p are each 0, 1, 2, 3, or 4,
with from 1 to 100 mol % of (D) ##STR2## where R.sup.5 and R.sup.6 have the same meaning as R.sup.1 and R.sup.2, and v and w are each 0, 1, 2, 3 or 4, and from 0 to 99 mol % of (E) ##STR3## where R.sup.7 -R.sup.10 are each Cl or F or have the same meanings as R.sup.1 and R.sup.2, q is 0 or 1, r, s, t and n are each 0, 1, 2, 3 or 4, Z.sub.1 is --SO.sub.2 -- or --CO-- and Z.sub.2 is --O--, --S--, --SO.sub.2 --, --CO-- or a chemical bond,
with the proviso that one or more of the components C and E are present and the molar ratio of B to the sum of A and C is not greater than 1.

REFERENCES:
patent: 4489181 (1984-12-01), Fox et al.

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