Method of making circuit path conductors in plural planes

Details Method of making circuit path conductors in plural planes Method of making circuit path conductors in plural planes

1981-06-01

1982-11-02

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

29853, H01K 300

Patent

active

043566278

ABSTRACT:
A circuit board is fabricated from a metal layer laminated to an underlying dielectric substrate. A stamping die, or roller, formed with a deeply impressed pattern of circuit paths, is indented through the metal and into the substrate. The metal is formed into circuit path conductors, electrically isolated from one another by insetting sheared away portions of the metal into indented portions of the substrate.

REFERENCES:
patent: 2912748 (1959-11-01), Gray
patent: 2925645 (1960-02-01), Bell et al.
patent: 2986804 (1961-06-01), Greenman et al.
patent: 2988839 (1961-06-01), Greenman et al.
patent: 3431350 (1969-03-01), Haberecht
patent: 3628243 (1971-12-01), Pohl et al.
patent: 3911716 (1975-10-01), Weglin

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