Wire bonding method with a frame, for connecting an electronic c

Details Wire bonding method with a frame, for connecting an electronic c Wire bonding method with a frame, for connecting an electronic c

1989-11-03

1991-03-26

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437206, 437228, 357 70, H01L 2160

Patent

active

050028952

ABSTRACT:
A device and method are disclosed for connecting an electronic component so that it can be tested and mounted. According to the method, pads on the component are first connected to pads on a surrounding frame, by means of conducting wires. The component is tested by probes of the testing instruments to the pads of the surrounding frame. When the tests are done, the component and its frame is placed on the substrate on which it has to be mounted. The pads of the component are connected to pads on the substrate by the wires used for connection to the pads of the surrounding frame. After connection, the wires are cut between the substrate pads and the frame pads, and then the frame is removed.

REFERENCES:
patent: 3795043 (1974-03-01), Forlani
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patent: 4027383 (1977-06-01), Herndon et al.
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patent: 4189825 (1980-02-01), Robillard et al.
patent: 4243937 (1981-01-01), Multani et al.
patent: 4411719 (1983-10-01), Lindberg
patent: 4792532 (1988-12-01), Ohtani et al.

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