Method for packaging integrated circuit chips employing a polyme

Details Method for packaging integrated circuit chips employing a polyme Method for packaging integrated circuit chips employing a polyme

1988-08-30

1990-06-12

Cashion, Jr., Merrell C.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562755, 1562757, 156286, 156289, 156299, B44C 120

Patent

active

049330420

ABSTRACT:
A method and apparatus are provided for disposing a polymer film on an irregularly-shaped substrate at relatively high temperatures. In particular, the method and apparatus of the present invention provide a system for the packaging of very large scale intergrated circuit chips. The system of the present invention particularly solves problems associated with high temperature processing and problems associated with the highly irregular surfaces that result. Nonetheless, the resultant product is capable of being fashioned into circuit chip systems which are independently testable and which may be reconfigured after testing by removal of the polymer film itself.

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