1977-12-12
1980-12-16
Brown, Thomas W.
179156R, H04R 110
Patent
active
042399459
ABSTRACT:
A sealed headphone having an improved sound pressure versus frequency response characteristic is disclosed. The sealed headphone comprises a mounting plate having coupling apertures, an electro-acoustic transducer attached to one side of the mounting plate and a casing covering the transducer. A space defined by the rear side of the transducer and the casing communicates via the coupling apertures with another spaced formed on the opposite side of the mounting plate so as to form an acousto-mechanical resonance circuit within the headphone. By raising the parallel resonance frequency of the resonance circuit, a higher reproduced frequency limit of the headphone is achieved.
REFERENCES:
patent: 1366607 (1921-01-01), Steinberger
patent: 2603724 (1952-07-01), Kettler
patent: 3220505 (1965-11-01), Hargrave
"Improved Earphone Enclosure for Communication in Noise" by Bauer and DiMattia, Journal of Acoustical Soc. of America, vol. 51, No. 5 (1972), pp. 1388-1393.
"Audiometer-Earphone Mounting to Improve Intersubject and Cushion-Fit Reliability", by E. Villchur, Journal of the Acoustical Soc. of America, vol. 48, No. 6 (Part 2), Dec. 1970, pp. 1387-1396.
Atoji Nobuhisa
Kusomoto Shoichi
Sato Kazue
Brown Thomas W.
Matsushita Electric - Industrial Co., Ltd.
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