High moisture wood laminating process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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144309Q, 156327, 156331, 156335, 428212, 428528, 428535, B32B 3120, B32B 2108, B32B 514

Patent

active

042395771

ABSTRACT:
Disclosed is a process for making wood laminates from a plurality of wood plies having relatively high moisture contents. By employing a center ply having a moisture content of at least 3%, relatively high moisture content plies can be employed in the preparation of wood laminates without experiencing defective panels due to the blow out of steam built up during pressing. The outer plies can have moisture contents of as high as 25%. Additionally, interior plies other than the center ply can also have moisture contents similar to that of the center ply or can have moisture contents below that of the outer plies.

REFERENCES:
patent: 3919017 (1975-11-01), Shoemaker et al.
patent: 4115178 (1978-09-01), Cone et al.
Chen & Rice, "Veneer and Assembly Condition Effects on Bond Quality in Southern Pine Plywood," Forest Products Journal, vol. 23, No. 10, Oct. 1973, pp. 46-49.

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