Front-to-back alignment procedure for Burrus LED's

Details Front-to-back alignment procedure for Burrus LED's Front-to-back alignment procedure for Burrus LED's

1985-12-02

1987-06-02

Chaudhuri, Olik

Metal working

Plural diverse manufacturing apparatus including means for...

Common reciprocating support for spaced tools

29578, 29580, 29590, 156656, 156657, 1566591, 148DIG102, H01L 21302, H01L 21312

Patent

active

046691758

ABSTRACT:
A method for accurate front-to-back alignment of patterns onto a wafer for fabrication of multiple Burrus LED's. The front surface of the wafer has on it epitaxial layers, a dielectric layer and a metallization layer. The metallization layer includes perpendicular alignment indicia which intersect at metal contacts of the front surface of the wafer. The perimeter of the wafer is etched away to reveal the alignment indicia which when thus exposed are visible from the back side of the wafer. The exposed indicia is used to align holes in the backside metal contact to the metal contacts on the front surface.

REFERENCES:
patent: 4249967 (1981-02-01), Liu et al.
patent: 4342148 (1982-08-01), Springthorpe et al.
patent: 4536469 (1985-08-01), Adlerstein

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