Process for improving polymer substrate properties, and modified

Coating processes – With post-treatment of coating or coating material – Chemical agent applied to treat coating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427386, 4273899, 4274301, 428264, 428265, 428267, 428270, B05D 118, B05D 302, B05D 304, B32B 700

Patent

active

047269685

ABSTRACT:
A process for improving the hygroscopic, soil release and other properties of a polymer substrate is provided in which the substrate is contacted with a suitable aqueous mixture containing a water-soluble cross-linking vinyl monomer and an organic hydrophobic carrier compound at a temperature of between about 40.degree. C. to 100.degree. C. Polymerization of the monomer is thereafter initiated by a chemical or physical initiator to form a vinyl polymer evenly disposed on the substrate. The hygroscopic, soil release and other surface properties of the substrate are thereby improved. The mixture may be in the form of an emulsion wherein the hydrophobic carrier compound is emulsified by an appropriate agent. The invention also pertains to the improved substrates prepared in accordance with the present process.

REFERENCES:
patent: 3652212 (1972-03-01), Machell
patent: 4065256 (1977-12-01), Igeta et al.
patent: 4081383 (1978-05-01), Warburtan et al.
patent: 4242408 (1980-10-01), Evani et al.
patent: 4448839 (1984-05-01), Morris

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for improving polymer substrate properties, and modified does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for improving polymer substrate properties, and modified, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for improving polymer substrate properties, and modified will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-602223

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.