Method of manufacturing a multilayer electronic component

Details Method of manufacturing a multilayer electronic component Method of manufacturing a multilayer electronic component

1995-05-10

1997-07-01

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 174266, 29852, H05K 102

Patent

active

056441070

ABSTRACT:
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

REFERENCES:
patent: 3185947 (1965-05-01), Freymodsson
patent: 3964087 (1976-06-01), Mallon
patent: 4372046 (1983-02-01), Suzuki
patent: 4821007 (1989-04-01), Fields et al.
patent: 5060369 (1991-10-01), Date
patent: 5140745 (1992-08-01), McKenzie, Jr.
patent: 5499446 (1996-03-01), Murakami
patent: 5502885 (1996-04-01), Hanamura et al.

Affiliated with

Also associated with

Rating

Method of manufacturing a multilayer electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a multilayer electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a multilayer electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-599227