Soldering apparatus

Details Soldering apparatus Soldering apparatus

1986-07-17

1988-02-23

Jordan, M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

2281801, H05K 334, B23K 100

Patent

active

047265060

ABSTRACT:
A soldering apparatus is disclosed having a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between the first and second vessels and having a pump for feeding the vapors produced in the second vessel to the first vessel, and a liquid recycling conduit extending between the first and second vessels and having a pump for recycling heat transfer liquid formed by the condensation of the vapors and collected in the first vessel to the second vessel.

REFERENCES:
patent: 3291030 (1966-12-01), Arnold
patent: 3866307 (1975-02-01), Pfahl et al.
patent: 3904102 (1975-09-01), Chu et al.
patent: 4115601 (1978-09-01), Ammann et al.
patent: 4315042 (1982-02-01), Spigarelli
patent: 4392049 (1983-07-01), Bentley et al.
patent: 4538757 (1985-09-01), Bertiger
IBM Bulletin, Technical Disclosure Bulletin, vol. 22, No. 5, Oct. 1979, p. 1833, Soldering Tool Employing Hot Vapors.

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