Polyimidosiloxane compositions

Details Polyimidosiloxane compositions Polyimidosiloxane compositions

1996-03-14

1997-07-01

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524 99, 524104, 524167, 524173, 524211, 524351, 524352, 524356, 524379, 524386, 524367, 524233, 524449, 524423, 525423, 525476, 528 26, 528 28, 528 38, C08K 506

Patent

active

056439865

ABSTRACT:
A composition containing 100 parts by weight of a soluble polyimidosiloxane obtained by polymerization and imidation of an aromatic tetracarboxylic acid component and a component comprising a diaminopolysiloxane, an aromatic diamine with a hydroxyl group and optionally another aromatic diamine, 1 to 50 parts by weight of an epoxy resin, and optionally, also 2 to 150 parts by weight of an inorganic filler such as mica, silica or barium sulfate, and an organic solvent. The composition is homogeneously soluble in organic solvents, and when formed into a protective film on a flexible wiring board it has high heat resistance, flexing resistance, adhesion and chemical resistance (against soldering flux and tin plating solutions).

REFERENCES:
patent: 4586997 (1986-05-01), Lee
patent: 4981940 (1991-01-01), Konotsune et al.
patent: 5252703 (1993-10-01), Nakajima et al.

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