Epoxy resin compositions and cured products

Details Epoxy resin compositions and cured products Epoxy resin compositions and cured products

Filed on

1995-03-30

Date issued

1997-07-01

Examiner

Bleutge, John C.

Patent Class

Synthetic resins or natural rubbers -- part of the class 520 ser

SubClass

Synthetic resins

SubSubClass

Processes of preparing a desired or intentional composition...

Other Related Categories

525 64, 525 65, 525 68, 525 69, 525 77, 525 79, 525109, 525112, 525113, 525481, 525486, 525524, 525529, 525942, C08L 902, C08L 6300, C08L 5100

Type

Patent

Status

active

Patent number

056439750

Description

ABSTRACT:
An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

REFERENCES:
patent: 4366289 (1982-12-01), Keskkula et al.
patent: 4371668 (1983-02-01), Ikeda et al.
patent: 4419496 (1983-12-01), Henton et al.
patent: 4529755 (1985-07-01), Nishikawa et al.
patent: 4565853 (1986-01-01), Herscovici et al.
patent: 4761463 (1988-08-01), Matsumoto et al.
patent: 4778851 (1988-10-01), Henton et al.
patent: 4786675 (1988-11-01), Iwata et al.
patent: 4885336 (1989-12-01), Boutni et al.
patent: 4897447 (1990-01-01), Williams
patent: 4916174 (1990-04-01), Yoshizumi et al.
patent: 4999135 (1991-03-01), Matsuda et al.
patent: 5019608 (1991-05-01), Shah
patent: 5068267 (1991-11-01), Uehida et al.
patent: 5237003 (1993-08-01), Otawa et al.
"The HandBook of Epoxy Resins" Lee & Neville 1982 Reissue pp. (14-1 to 14-5, 15-16 and 15-17, 5-16 to 5-18).

Affiliated with

Also associated with

Rating

Epoxy resin compositions and cured products does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Epoxy resin compositions and cured products, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epoxy resin compositions and cured products will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-597981