Flip chip devices with flexible conductive adhesive

Details Flip chip devices with flexible conductive adhesive Flip chip devices with flexible conductive adhesive

1998-10-05

2000-08-22

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 361760, 361783, 257736, 257626, 257249, 257737, 257738, 174255, 174256, 174260, H05K 702

Patent

active

061082104

ABSTRACT:
An electronic device includes one or more semiconductor chips interconnected to a next level substrate in a flip chip mode using flexible conductive adhesive having a low modulus of elasticity. The flexible conductive adhesive is applied as conductive bumps on the contact pads of the substrate or on the contact pads of the semiconductor chips and is a flexible thermoplastic or thermosetting resin filled with electrically-conductive particles. Other electronic devices, such as packaged components including resistors, capacitors and the like, are bonded with the same flexible conductive adhesive bump approach as is employed for the semiconductor chips. The contact pads of both the chip and the next level substrate are preferably passivated with a metallic coating, preferably a precious metal, prior to interconnection to inhibit oxidation of the pads. A flexible insulating organic underfill may be used, preferably one having substantially the same low modulus of elasticity as that of the flexible conductive adhesive.

REFERENCES:
patent: 2774747 (1956-12-01), Wolfson et al.
patent: 3401126 (1968-09-01), Miller et al.
patent: 3429040 (1969-02-01), Miller
patent: 4005472 (1977-01-01), Marris et al.
patent: 4007476 (1977-02-01), Hutson
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4404237 (1983-09-01), Eichelberger et al.
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4514751 (1985-04-01), Bhatacharya
patent: 5048166 (1991-09-01), Wakamatsu
patent: 5074947 (1991-12-01), Estes et al.
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5366589 (1994-11-01), Chang
patent: 5386341 (1995-01-01), Olson et al.
patent: 5406122 (1995-04-01), Wong et al.
patent: 5439731 (1995-08-01), Li et al.
patent: 5478973 (1995-12-01), Yoon et al.
patent: 5502002 (1996-03-01), Wong et al.
patent: 5611140 (1997-03-01), Kulesza et al.
patent: 5667884 (1997-09-01), Bolger
patent: 5879761 (1999-03-01), Kulesza
patent: 5937320 (1999-08-01), Andricacos et al.
P. Scharf, T. Coleman and K. Avellar, "Flip Component Technology", IEEE Electronic Component Conference (1967), pp. 269-274.
Gilleo, K: "Direct Chip Interconnect Using Polymer Bonding", IEEE 39th Electronic Component Conference, May 1989, PP37-44.
R. Lachance, H. Lavoie, A Montanari, "Corrosion/Migration Study of Flip Chip Underfill and Ceramic Overcoating", IEEE Electronic Components and Technology Conference (1997), pp. 885-889.
T.Y. Wu, Y. Tsukada, W.T. Chen, "Materials and Mechanics Issues in Flip-Chip Organic Packaging", IEEE Electronic Components and Technology Conference (1996), pp. 524-534.
B. Rosner, J. Liu, Z. Lai, "Flip Chip Bonding Using Isotopically Conductive-Adhesives", Electronic Components and Technology Conference, (1996) pp. 578-581.
D. Gamota, C. Melton, "Advanced Encapsulant Materials Systems for Flip Chip", Advancing Microelectronics (Jul./Aug. 1997) pp. 22-24.
R.W. Johnson, D. Price, D. Maslyk, M. Palmer, S. Wentworth, C. Ellis, "Adhesive Based Flip Chip Technology for Assembly on Polyimide Flex Substrates", IEEE International Conference on Multichip Modules, 1997, pp. 81-86.
L. Schaper, K. Maner, S. Ang, "Reliability of Large Conductive Polymer Flip Chip Assemblies for Multichip Modules (MCMs)", IEEE International Conference on Multichip Modules (1997), pp. 87-91.
Dr. V. Ozguz, R. DeLosReyes, Dr. K. Chung, Dr. J. Licari, "Flexible Conductive Adhesive Bumps for Chip Scale Packaging", The Technical Conference At Chip Scale International, May 1998, pp. 15-19.
K. Chung, V. Ozguz, "Flexible Conductive Adhesive as Solder Replacement in Flip Chip Interconnection", Jul. 1998, pp. 1-14.
"Cost Effective Solutions for Advanced Semiconductor Interconnection and Packaging", AI Technology, Inc., Jul. 1998.

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