Hermetically sealed compression bonded circuit assembly having a

Details Hermetically sealed compression bonded circuit assembly having a Hermetically sealed compression bonded circuit assembly having a

1988-08-01

1991-01-15

Hille, Rolf

357 81, 357 74, H01L 2342, H01L 2344, H01L 2346

Patent

active

049857525

ABSTRACT:
A harmetically sealed circuit assembly (10) containing a plurality of circuit elements (74, 76 and 80) which are to be compression bonded upon application of a force through opposed first and second walls (12, 20) of a hermetically sealed chamber containing the circuit elements to be compression bonded in accordance with the invention includes a plurality of columns (20-30) within the chamber with each circuit element to be compression bonded being disposed in a separate column; an inelastically deformed element (124-132) positioned in each of the columns outside the chamber having a first surface facing an outside surface of one of the first and second walls of the hermetically sealed chamber and a second surface with each of the second surfaces of the deformed springs facing an outside surface of another of the first and second walls; and a thickness of the columns measured between the outside surfaces of the first and second walls prior to compression bonding being substantially identical.

REFERENCES:
patent: 3017550 (1962-01-01), Dickson, Jr.
patent: 3204327 (1965-09-01), da Costa
patent: 3266125 (1962-11-01), Tobolski
patent: 3372310 (1968-03-01), Kantor
patent: 3443168 (1969-05-01), Camp et al.
patent: 3551758 (1970-12-01), Ferree
patent: 3573574 (1971-04-01), Davis
patent: 3575574 (1971-04-01), Almqvist
patent: 3602793 (1971-08-01), Grozinger
patent: 3649881 (1972-03-01), Chang
patent: 3652903 (1972-03-01), Eriksson et al.
patent: 3719862 (1973-03-01), Gaicki
patent: 3745505 (1973-07-01), Turnbull et al.
patent: 3749983 (1973-07-01), Beriger
patent: 3808471 (1974-04-01), Grandia
patent: 3826953 (1974-07-01), Le Gales
patent: 3886654 (1975-06-01), Erdle
patent: 3921201 (1975-11-01), Eisele et al.
patent: 3936704 (1976-02-01), Brenneman et al.
patent: 4090233 (1978-05-01), Thiele et al.
patent: 4178630 (1979-12-01), Olsson
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4313128 (1982-01-01), Schlegel et al.
patent: 4390891 (1983-06-01), Bahlinger
patent: 4504850 (1985-03-01), Pollard et al.
patent: 4583005 (1986-04-01), Bevans
patent: 4604643 (1986-08-01), Yotsumoto et al.
patent: 4631573 (1986-12-01), Sutrina
patent: 4658086 (1987-04-01), McLeod et al.
patent: 4672422 (1987-06-01), Schierz
patent: 4692790 (1987-09-01), Oyamada
patent: 4830979 (1989-05-01), Crowe et al.

Affiliated with

Also associated with

Rating

Hermetically sealed compression bonded circuit assembly having a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hermetically sealed compression bonded circuit assembly having a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically sealed compression bonded circuit assembly having a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-58748