Universal tape for use in tape automated bonding system

Details Universal tape for use in tape automated bonding system Universal tape for use in tape automated bonding system

1989-12-27

1991-01-15

Mintel, William

357 68, 357 70, 357 72, 357 80, 357 65, H01L 2348, H01L 2328, H01L 3902

Patent

active

049857487

ABSTRACT:
An improved method of tape automated bonding that makes use of a "universal" tape to accommodate integrated circuit chips having different bonding site patterns. The tape comprises a series of parallel continuous thin metal beam lead conductors fixed to a flexible plastic substrate. Two such tapes are disposed at right angles to each other forming in effect a square matrix of beam lead conductors. Each tape site is custom trimmed to match the bonding pad locations of each different integrated circuit chip.

REFERENCES:
patent: 4663650 (1987-05-01), Gilder, Jr. et al.

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