Compact optical semiconductor module capable of being readily as

Details Compact optical semiconductor module capable of being readily as Compact optical semiconductor module capable of being readily as

1992-08-24

1994-02-01

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

257 99, 257737, 257778, 257779, H01L 2714, H01L 3100

Patent

active

052834468

ABSTRACT:
In an optical semiconductor module having an optical semiconductor chip mounted on a substrate through a plurality of solder bumps each of which has a predetermined height and which is formed by molten solder, each of the bumps is surrounded by a side wall lower than the predetermined height of each bump. The optical semiconductor chip is precisely positioned on the substrate not only in a horizontal direction by self-alignment effect of the molten solder but also in a vertical direction due to shrinkage of the molten solder with a bottom surface of the optical semiconductor chip kept in contact with an upper surface of the side walls, upon cooling the molten solder.

REFERENCES:
patent: 5001829 (1991-03-01), Schelhorn
patent: 5134340 (1992-07-01), Haitz
Katsura et al., Journal of Lightwave Technology, vol. 8, No. 9, pp. 1323-1327, Sep. 1990.

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