Modular multilayer interwiring structure

Details Modular multilayer interwiring structure Modular multilayer interwiring structure

1992-05-04

1994-02-01

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428210, 428432, 428433, B32B 900

Patent

active

052831078

ABSTRACT:
A modular multilayer interwiring structure comprising a plurality of relatively small parts which are produced separately as `sub-units` (1). Each individual layer of the final structure is formed by joining a respective set of unit parts in one plane. The whole multilayer structure is then built by stacking these layers, preferably so that the units of one layer are not vertically aligned with the units of an adjacent layer. Each unit part includes at least one layer of conductive material (8, 9) on its front and/or rearside. These conductive layers may be individually patterned into diverse interconnection lines (5). Throughconnections (6) extending from the frontside to the backside of the units are provided using a desired set or a standardized array of via holes or openings filled with conductive material. By connecting desired throughconnections to the respective conduction lines, each unit may form an individual part of a more complex multilayer interwiring structure.

REFERENCES:
patent: 4631636 (1986-12-01), Andrews
patent: 4990462 (1991-02-01), Sliwa, Jr.
Extended Abstracts/Spring Meeting 88-1, vol. 15, No. 20, May 1988, Princeton, N.Y., pp. 66-67, C. Ting et al., "Silicon Interconnection Substrates for Multichip Packaging".

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