Thermosetting resin compositions

Details Thermosetting resin compositions Thermosetting resin compositions

1992-08-11

1994-03-01

Dean, Ralph H.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525476, 525502, 523429, 523433, 523435, 528 97, 528117, 528 27, C08L 6304, C08L 6310

Patent

active

052908828

ABSTRACT:
A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.

REFERENCES:
patent: 4127615 (1978-11-01), Zahir et al.
patent: 4551508 (1985-11-01), Urasaki
patent: 4816531 (1989-03-01), Young
patent: 5006614 (1991-04-01), Itoh et al.
patent: 5070154 (1991-12-01), Shiobara et al.
patent: 5095074 (1992-03-01), Chu et al.

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