Mounting housing for leadless chip carrier

Details Mounting housing for leadless chip carrier Mounting housing for leadless chip carrier

1982-04-19

1985-01-01

Bilinsky, Z. R.

Geometrical instruments

339 17CF, 339 75M, H01R 1362

Patent

active

044913770

ABSTRACT:
Disclosed is a mounting housing for leadless chip carriers for use on burn-in boards, circuit boards and the like. The housing includes an insulating base support containing a plurality of electrically conductive axially elongated bodies extending therethrough arranged to define a rectangular cavity in a plane parallel with the first major face of the base support. The ends of the axially elongated bodies defining the cavity have edges inclined inwardly toward the cavity and edges inclined outwardly from the cavity. A spreader mounted for reciprocal movement axially with respect the elongated bodies has an inclined surface mating with the outwardly inclined edges of the elongated bodies so that movement of the spreader moves the inwardly inclined edges outwardly to permit insertion of a leadless chip carrier within the cavity.

REFERENCES:
patent: 3199066 (1965-08-01), Eledge et al.
patent: 3744005 (1973-07-01), Sitzler
patent: 3753211 (1973-08-01), Pauza et al.
patent: 4159861 (1979-07-01), Anhalt
patent: 4390220 (1983-06-01), Benasutti

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