Apparatus for controlled spray etching

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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156640, 156664, 118316, 118684, 118669, H01L 2100

Patent

active

052903842

ABSTRACT:
An apparatus is provided for controlled spray etching, in which panels, such as printed circuit boards are delivered through an etching chamber, to have a spray etchant sprayed generally on upper and lower surfaces of the panel. The spray is controlled such that a reduced amount of etchant is provided on the perimeter surface portions of the panel, relative to the central surface portions of the panel, transversely of the path of travel of the panels through the etching chamber. The spray may be varied in amount, preferably by varying the pressure at different locations transversely of the chamber; the spray longitudinally through the chamber, may vary, to spray leading and trailing surface portions of the panels a lesser amount than central portions of the panels, measured longitudinally. The control of the spray of leading and trailing surface portions of the panels may be facilitated by one or more sensors that control an intermittent discharge of spray etchant near the inlet to the etch chamber.

REFERENCES:
patent: 3808067 (1974-04-01), Brown
patent: 4126510 (1978-11-01), Moscony et al.
patent: 4352994 (1982-10-01), Inzoli et al.
patent: 4397708 (1983-08-01), Frantzen
patent: 4662976 (1993-07-01), Homuller
patent: 4741798 (1988-05-01), Haas
patent: 4985111 (1991-01-01), Ketelholm
patent: 5002627 (1991-03-01), Scheithauer et al.
patent: 5228949 (1993-07-01), Ketelhohn et al.
"Photocell Controlled Etchen",-IBM Technical Disclosure Bulletin; vol. 10; No. 5; Oct. 1967; pp. 582-584 Greene et al.
Japanese Abstract 59-93881 (in English) for Application No. 57-202505.
Hollmuller PCP System Technology.
Aetztechnik Fuer Feinstleiter.
Fine-Line Etching.
Hollmuller Fine-Line Etching.

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