Optical sub-assembly package mount

Details Optical sub-assembly package mount Optical sub-assembly package mount

1998-09-15

2000-08-22

Ngo, Hung N.

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

385 93, G02B 636

Patent

active

061061611

ABSTRACT:
Compliant, resilient mounting means are provided for minimizing stress on the platform of an optical sub-assembly package caused by temperature change and the like so as to maintain good alignment between the laser beam emitted from a laser chip mounted on the platform and the lens of an optical fiber also mounted on the platform. The resilient means comprise resilient solder bumps of the order of 625 microns thick interposed between the platform and the base to provide a resilient connection between the platform and the base, thereby maintaining good alignment between the laser beam and the lens by reducing the stresses on the optical sub-assembly platform that tend to be caused by temperature changes or the mounting of the package to a rigid, external platform, as by bolting.

REFERENCES:
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patent: 5432358 (1995-07-01), Nelson et al.
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patent: 5537502 (1996-07-01), Patel et al.
patent: 5689279 (1997-11-01), Nelson et al.
patent: 5700987 (1997-12-01), Basavanhally
patent: 5845030 (1998-12-01), Sasaki et al.
N. Basavanhally, "Application of soldering technologies for opto-electronic component assembly," ASME Int. Electronic Packaging Conference, New York: ASME, 1993, pp. 1149-1155.
Y. C. Lee and N. Basavanhally, "Soldering engineering for optoelectronic packaging," J. Metals, Jun. 1994.
N. R. Basavanhally, M. F. Brady, and D. Bruce Buchholz, "Optoelectronic Packaging of Two-Dimensional Surface Active Devices," IEEE Transactions on Components, Packaging, and Manufacturing Technology--Part B, vol. 19, No. 1, Feb. 1996, pp. 107-115.

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