Device panel with in-molded applique

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electrical power distribution systems and devices

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Details

200296, 200512, 361792, H02B 104

Patent

active

055746233

ABSTRACT:
A method of producing a molded assembly for at least partially encapsulating a touch panel structure. The method includes providing a touch panel structure which has a front side, a reverse side and an edge extending therebetween. A circuit is attached to the panel structure and includes at least one device. The panel is positioned in a cavity of a plastic injection mold which includes a hollow shutoff positioned relative to the device on the touch panel. When the mold is closed, a rim portion of the hollow shutoff is positioned against the reverse side of the panel spaced away from the device so as to at least partially shield the portion of the panel containing the device from the injection molding environment. The present invention also envisions a product produced by this method. The present invention further envisions a molded assembly which includes a touch panel in which the touch panel is retained in a molded portion and the devices associated with the touch panel are not degraded during the molding process. A window is provided on the reverse side of the touch panel. Additionally, a barrier material may be applied to the reverse side of the panel prior to molding so as to form a seal between the molded portion and the touch panel in the area of the window positioned relative to the device.

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patent: 5430266 (1995-07-01), Austin, Jr.

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