Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-03-30
1998-03-31
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257686, 257697, 257713, 361715, 361719, H05K 720
Patent
active
057345554
ABSTRACT:
An electronic package for an integrated circuit (IC). The package has a plurality of first pins extending from a laminated plastic/printed circuit board substrate. The pins are coupled to the integrated circuit and provide a means for mounting the package to an external printed circuit board. The package also has an internal circuit board that is coupled to both the substrate and the IC by a plurality of second pins. Mounted to the circuit board are passive and/or active electrical elements that are connected to the integrated circuit through the second pins. Some of the second pins may extend entirely through the substrate to directly couple the internal circuit board and electrical elements to the external printed circuit board. To improve the thermal impedance of the package, the integrated circuit is mounted to a heat slug which can be attached to a heat sink. The heat sink may also provide a substrate for the internal circuit board.
REFERENCES:
patent: 3403300 (1968-09-01), Horowitz et al.
patent: 4514784 (1985-04-01), Williams et al.
patent: 4729061 (1988-03-01), Brown
patent: 5016138 (1991-05-01), Woodman
patent: 5036431 (1991-07-01), Adachi et al.
Intel Corporation
Thompson Gregory D.
LandOfFree
Shared socket multi-chip module and/or piggyback pin grid array does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Shared socket multi-chip module and/or piggyback pin grid array , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shared socket multi-chip module and/or piggyback pin grid array will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-56686