Process for forming thin film

Coating processes – Electrical product produced – Welding electrode

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427 541, 427 86, 427 93, 427 94, C23C 1700

Patent

active

044952180

ABSTRACT:
A thin film of a-Si, SiO.sub.2 or Si.sub.3 N.sub.4 can be formed on a substrate using a starting material gas containing at least a polysilane of the formula Si.sub.n H.sub.2n+2 (n=2, 3 or 4) by a chemical vapor deposition method with irradiation with light with high film forming rate at lower temperatures.

REFERENCES:
patent: 3200018 (1965-08-01), Grossman
patent: 3271180 (1966-09-01), White
patent: 4348428 (1982-09-01), Rockley et al.
patent: 4363828 (1982-12-01), Brodsky et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for forming thin film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming thin film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming thin film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-566775

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.