Printed circuit board having an injection molded substrate

Details Printed circuit board having an injection molded substrate Printed circuit board having an injection molded substrate

1989-09-13

1991-01-15

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

29849, 29852, 174261, 174266, H05K 100, H05K 310

Patent

active

049856006

ABSTRACT:
A printed circuit board includes an injection molded substrate having a pattern recessed in the substrate surface of interconnect traces, through-connections and contact rods. A trench-shaped depression is provided in the substrate surface in the region of each interconnect trace, and a planar depression is provided in the substrate surface in at least one of (a) the region of each through-connection and (b) the region of each contact surface. The pattern of recesses is covered with a conductive metal coat, and the width of each trench-shaped depression is dimensioned narrowly in comparison of the width of each planar depression, so that the metal coat fills the trench-shaped depressions to the surface of the substrate, while in the planar depressions a distance remains between the metal coat and the surface of the substrate. A solder stop lacquer can then be applied, such as by roller coating, without the necessity of photo-structuring and without filling the planar depressions.

REFERENCES:
patent: 4363930 (1982-12-01), Hoffman
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4402135 (1983-09-01), Schweingruber et al.
patent: 4510347 (1985-04-01), Wiech, Jr.
patent: 4532152 (1985-07-01), Elarde
patent: 4604799 (1986-08-01), Gurol

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