Substrate for printed circuit board

Details Substrate for printed circuit board Substrate for printed circuit board

1998-05-20

2000-01-18

Zirker, Daniel

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

428901, B32B 712

Patent

active

060158727

ABSTRACT:
To address the problem of difficulty of making compatible flame retarding property and electrical and mechanical characteristics in conventional printed interconnection substrates, the present invention employs, in a substrate for printed circuit board of which the insulating material comprises a thermosetting resin composition comprising an epoxy resin main component and a curing agent, an epoxy resin containing a brominated phenol novolac type epoxy resin having a biphenyl skeleton as the main component or a curing agent containing a brominated phenol novolac type curing resin. It provides a substrate for printed circuit board which has an extremely high flame retarding property and a superior heat resistance and humidity resistance, as well as a high insulating reliability and a superior high frequency characteristic.

REFERENCES:
patent: 4874669 (1989-10-01), Larson et al.
patent: 4997702 (1991-03-01), Gazit et al.
patent: 5102970 (1992-04-01), Wang
patent: 5112926 (1992-05-01), Lee et al.
patent: 5412002 (1995-05-01), Enomoto et al.

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