Method of removing residual charges of an electrostatic chuck us

Details Method of removing residual charges of an electrostatic chuck us Method of removing residual charges of an electrostatic chuck us

1994-09-20

1996-11-12

Nguyen, Nam

Fishing, trapping, and vermin destroying

437250, 1566431, 118620, 118723R, 118728, 361234, 269 8, 427289, H01L 2100, H05F 300, B25B 1100

Patent

active

055739814

ABSTRACT:
A method depositing a layer onto a wafer is disclosed. The method has the steps of: affixing the wafer to a wafer support within a deposition chamber by using a single-pole electrostatic chuck; depositing a layer onto a surface of the wafer by plasma by CVD; exhausting a deposition gas used for depositing the layer from the deposition chamber; introducing a residual charge removing gas into the deposition chamber; and forming a residual charge removing plasma by discharging the gas to remove residual charges of the single-pole electrostatic chuck.

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patent: 5382311 (1995-01-01), Ishikawa et al.
patent: 5395796 (1995-03-01), Haskell et al.
patent: 5474614 (1995-12-01), Robbins

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