Semiconductor arrangement

Details Semiconductor arrangement Semiconductor arrangement

1975-08-20

1976-07-20

Wojciechowicz, Edward J.

357 68, 357 71, H01L 2348, H01L 2944, H01L 2946

Patent

active

039710629

ABSTRACT:
A semiconductor arrangement comprises metal contacting strip means forming a pattern of connecting parts for receiving semiconductor components or their connecting wires, in which metallized insulating platelets are provided on the metal contacting means and connected to semiconductor components and/or contact points by connecting wires.

REFERENCES:
patent: 3588616 (1971-06-01), Palazzini
patent: 3717800 (1973-02-01), Thillays et al.
patent: 3784883 (1974-01-01), Duncan et al.

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