Apparatus for reducing warping of plastic packages

Details Apparatus for reducing warping of plastic packages Apparatus for reducing warping of plastic packages

1997-04-28

2000-01-18

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427217, 425544, 425588, B29C 4502, B29C 4514

Patent

active

06015280&

ABSTRACT:
Methodology for reducing the warpage in thinly packaged electrical components, and electrical components packaged according to the method. The method taught herein is to make the gates themselves compliant, or flexible, thereby absorbing the stresses which would otherwise cause package deformation, including warpage. The present invention teaches two preferred embodiments for attaining this novel solution, including the adoption of wide, thin gates and the use of serpentine gates.

REFERENCES:
patent: 4126292 (1978-11-01), Saeki et al.
patent: 4741507 (1988-05-01), Baird
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5123826 (1992-06-01), Baird
patent: 5302101 (1994-04-01), Nishimura
patent: 5645864 (1997-07-01), Higuchi

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